Heat sink can be also spelled

heatsink, which is a passive heat exchanger that can transfer the heat generated by

electronic or mechanical equipment to a fluid medium (usually air or liquid coolant),

and then dissipate from the equipment to regulate the temperature of the equipment. In

computers, heat sinks are used to cool CPUs, GPUs, certain chipsets, and RAM modules.

The heat sink is used in high-power semiconductor devices (like power transistors) and

optoelectronic devices (like lasers and LEDs), where the heat dissipation capacity of

the component itself is insufficient to regulate its temperature.

Heat pipe heat

sink is composed of a sealing tube, suction core, and steam channel. The suction

core is surrounded on the wall of the sealed tube and impregnated with a saturated

volatile liquid. The liquid can be distilled water, ammonia, methanol or acetone. The

heat pipe heat sink filled with liquid such as ammonia, methanol and acetone still has

good heat dissipation ability at low temperature. When the heat pipe heat sink is

running, its evaporation section absorbs the heat generated by the heat source ( power

semiconductor device, etc.), making the liquid in its wick boil to steam. The heated

steam moves from the evaporating section of the heat pipe heat sink to its cooling

section, where it condenses into a liquid. The condensed liquid is then returned to the

evaporation section through the capillary action of the suction core on the wall, so as

to repeat the above cycle process of continuous heat dissipation.

Bonded fins technique is a conventional high power large heat sink manufacturing

technique. Bonded heat

sink may have the bad phenomenon of loose heat sink fins, especially with thick

heat sink fins, which will loose or even fall off at a higher rate. A bonded fin heat

sink has a few advantages over other heat sink technologies. For one, the aspect ratio

between the fin gap and fin height exceeds anything you can produce with extrusion. You

can get a 60:1 ratio with a bonded fin assembly, where extrusions can only get up to a

20:1 ratio. 

The cold

forged heat sink is a good choice for casting complex shapes with

excellent thermal conductivity. The cold forging process allows almost perfect

straightness of more fins per square millimeter. The shapes of cold-forged heat sinks

include a plate-fin heat sink,round pin heatsink, and oval fin heat sinks.

Offering reduced thermal resistance of up to 60%, folded fin heat sinks are

a high-performance method of meeting your cooling needs. Manufactured by folding

one continuous sheet of metal in a wave pattern to maximize cooling surface area, the

folded fins are then attached to the heatsink base by brazing, solder, or epoxy resin.

Zipper fin heat

sinks are a great heat transfer solution. While Lori uses them in the simplest

form, zipper fin has a wide range of applications and design flexibility. The zipper

fin heat sink can add additional strength to the heat sink and can allow for different

shapes of the stamped fins. The stamped die fins are then smoothed with a sanding belt,

and these stamped fins are then attached to a heatsink base typically using solder.

A vapor chamber

sometimes called a planar heat pipe or a vapor chamber heat spreader, is a two-phase

device used to spread heat from a heat source to a heat sink.  For electronics

cooling applications, the heat transfer is usually to a heat sink in very close

proximity to the heat source; a local as opposed to a remote heat sink.

AL extrusion

heat sinks are the most cost-effective solutions for most electronic cooling

applications. ATS offers a wide variety of aluminum profiles for custom heat sink

fabrication and other applications. ATS extrudes its heat sink profiles from high-

performance, smooth surface aluminum alloy 6063. Aluminum extrusion is the most

operational and cost-effective process for heat sink fabrications. There is a wide

range of heat sink structures available in the market and are produced as a result of

aluminum heat sink extrusions.

Liquid cold plates

are responsible for transferring heat from surfaces with high heat loads to the

fluid used within a liquid cooling system. The performance of these components is

critical to the overall effectiveness of the liquid system.

Friction stir welding liquid cold plates are finished with hard

anodized, so the fiber laser can withstand the test of a harsh service environment and

long-term fluid erosion. Friction Stir Welded Liquid Cold Plates are a critical

component of a liquid cooling system. Friction stir welded liquid cold

plates applied to a high power fiber laser, electric

automobile, semiconductor, optical communication,  military

transmitter, etc.